As the core carrier of electronic manufacturing, the internal structural quality of PCBs directly determines the reliability of end products. Metallographic sectioning inspection serves as the most rigorous "quality X-ray" in the PCB industry, unlocking the "hidden truth" of circuit boards step by step—from sample extraction, mounting, grinding, and polishing to microscopic observation.

Whether it is the interlayer bonding force of multilayer boards, the uniformity of through-hole plating, the microstructure of solder joints, or the peeling state between the substrate and copper foil, metallographic sectioning can accurately reveal it all.

For PCB companies, this inspection is not only a mandatory requirement to meet standards but also a core method for optimizing production processes and improving product yield. Through metallographic sectioning analysis, issues in processes such as drilling, lamination, and plating can be quickly identified, enabling targeted quality control.

A small section carries the safety baseline of electronic products. Conducting metallographic sectioning inspections well means building the first line of defense for PCB quality!

For the efficient preparation of PCB samples, coarse grinding is performed using P400 metallographic sandpaper, and fine grinding is carried out with a POS disk. The following plan is provided for reference:

Step 1: Grind with P400 metallographic sandpaper until reaching the edge of the target area.

Step 2: Grind with a POS disk and 9μm PD-WT polishing fluid until reaching the target area.

Step 3: Polish with an SC-JP polishing cloth and 3μm PD-WT polishing fluid.

Step 4: Polish with an ET-JP polishing cloth and 1μm PD-WT polishing fluid.