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With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

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Process Control for Black Solder Mask Silkscreen on PCBs: How to Prevent Typical Defects Like Stringing and Pinholes

Process Control for Black Solder Mask Silkscreen on PCBs: How to Prevent Typical Defects Like Stringing and Pinholes

Black silkscreen defects represent a high incidence category in PCB appearance-related customer complaints. Common issues include stringing (threading), ragged edges, pinholes/bubbles, missing or faint characters, misalignment, ink build-up (smearing), and poor adhesion/peeling. Unfortunately, many

Process Control for Black Solder Mask Silkscreen on PCBs: How to Prevent Typical Defects Like Stringing and PinholesJun 18, 2026 Process Control for Black Solder Mask Silkscreen on PCBs: How to Prevent Typical Defects Like Stringing and Pinholes375

DetailProcess Control for Black Solder Mask Silkscreen on PCBs: How to Prevent Typical Defects Like Stringing and Pinholes

Recyclable PCB Forward Design Specification: An End-to-End Optimization Guide

Recyclable PCB Forward Design Specification: An End-to-End Optimization Guide

Most enterprises only consider recycling and disposal after a product reaches its end-of-life, overlooking the decisive impact of front-end PCB design on recycling efficiency. For two PCBAs with identical functionality, a rational recyclability-oriented layout can increase metal recovery rates by 15

Recyclable PCB Forward Design Specification: An End-to-End Optimization GuideJun 17, 2026 Recyclable PCB Forward Design Specification: An End-to-End Optimization Guide499

DetailRecyclable PCB Forward Design Specification: An End-to-End Optimization Guide

Six-Layer PCB Stack-up DFM Guidelines: How to Mitigate Lamination Warpage

Six-Layer PCB Stack-up DFM Guidelines: How to Mitigate Lamination Warpage

Traces serve as the core medium for electrical connections on a PCB. A six-layer board comprises surface layers and two inner signal layers. Due to the constraints of multilayer stacking and limited etching space within inner layers, the DFM (Design for Manufacturability) specifications for traces a

Six-Layer PCB Stack-up DFM Guidelines: How to Mitigate Lamination WarpageJun 16, 2026 Six-Layer PCB Stack-up DFM Guidelines: How to Mitigate Lamination Warpage482

DetailSix-Layer PCB Stack-up DFM Guidelines: How to Mitigate Lamination Warpage

Challenges in Impedance Control for 4-Layer PCBs & Multilayer PCB Solutions

Challenges in Impedance Control for 4-Layer PCBs & Multilayer PCB Solutions

In high-speed circuits, RF modules, and products integrating power and signal lines, 4-layer PCBs have become the mainstream choice for industrial controls, communication equipment, and smart home hardware. This is due to their balanced routing space, electromagnetic shielding capabilities, and cost

Challenges in Impedance Control for 4-Layer PCBs & Multilayer PCB SolutionsJun 15, 2026 Challenges in Impedance Control for 4-Layer PCBs & Multilayer PCB Solutions274

DetailChallenges in Impedance Control for 4-Layer PCBs & Multilayer PCB Solutions

The Challenges of Impedance Control in 4-Layer PCBs and Mitigation Strategies for Multilayer Designs

The Challenges of Impedance Control in 4-Layer PCBs and Mitigation Strategies for Multilayer Designs

In high-speed circuits, RF modules, and products integrating power and signal lines, 4-layer PCBs have become the mainstream choice for industrial control, communication equipment, and smart home hardware. They offer a balanced combination of routing space, electromagnetic shielding capability, and

The Challenges of Impedance Control in 4-Layer PCBs and Mitigation Strategies for Multilayer DesignsJun 13, 2026 The Challenges of Impedance Control in 4-Layer PCBs and Mitigation Strategies for Multilayer Designs380

DetailThe Challenges of Impedance Control in 4-Layer PCBs and Mitigation Strategies for Multilayer Designs

The Function and Principle of PCB Embedded Copper Blocks

The Function and Principle of PCB Embedded Copper Blocks

In modern electronic product design, heat dissipation in Printed Circuit Boards (PCBs) has always been a core concern for engineers. As the integration density of electronic components continues to rise and chip power density climbs steadily, traditional cooling solutions are increasingly unable to

The Function and Principle of PCB Embedded Copper BlocksJun 12, 2026 The Function and Principle of PCB Embedded Copper Blocks343

DetailThe Function and Principle of PCB Embedded Copper Blocks
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