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Visit from American partners

Visit from American partners

Visit from American partnersDec 03, 2025 Visit from American partners1

With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

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Comparison of the Three Mainstream PCB Design Software: Altium Designer, PADS, Allegro

Comparison of the Three Mainstream PCB Design Software: Altium Designer, PADS, Allegro

In the field of electronic design, Altium Designer (AD), PADS, and Cadence Allegro are the three mainstream PCB design tools in engineering projects. Based on actual feedback from engineers, the following outlines the core features of these three software tools and the scenarios they are better sui

Comparison of the Three Mainstream PCB Design Software: Altium Designer, PADS, AllegroJan 13, 2026 Comparison of the Three Mainstream PCB Design Software: Altium Designer, PADS, Allegro1

DetailComparison of the Three Mainstream PCB Design Software: Altium Designer, PADS, Allegro

Analysis of CEM-3 and FR-4 Laminate Systems

Analysis of CEM-3 and FR-4 Laminate Systems

**Comparison of Lamination Process between CEM-3 and FR-4**As two mainstream PCB substrate materials, CEM-3 and FR-4 share common principles in their lamination processes. However, due to differences in their material structures, they have developed unique process characteristics and quality control

Analysis of CEM-3 and FR-4 Laminate SystemsJan 12, 2026 Analysis of CEM-3 and FR-4 Laminate Systems1

DetailAnalysis of CEM-3 and FR-4 Laminate Systems

Process Control for Flexible PCB Coverlay Lamination

Process Control for Flexible PCB Coverlay Lamination

**Question: What is the core function of the Flexible PCB (FPC) Coverlay Lamination Process? What are the specific aspects of its specification formulation?** The FPC coverlay lamination process involves bonding a coverlay (an adhesive-backed polyimide film) onto the surface of an FPC. Its core fun

Process Control for Flexible PCB Coverlay LaminationJan 10, 2026 Process Control for Flexible PCB Coverlay Lamination1

DetailProcess Control for Flexible PCB Coverlay Lamination

Exploring the Technical Characteristics of PCB Prototype SMT Assembly

Exploring the Technical Characteristics of PCB Prototype SMT Assembly

PCB prototype SMT (Surface Mount Technology) is an indispensable part of modern electronics manufacturing. It provides a reference for circuit board testing before mass production, helps identify deficiencies, and thereby avoids unnecessary errors and losses. This article will explore PCB prototype

Exploring the Technical Characteristics of PCB Prototype SMT AssemblyJan 09, 2026 Exploring the Technical Characteristics of PCB Prototype SMT Assembly1

DetailExploring the Technical Characteristics of PCB Prototype SMT Assembly

EMC Optimization Techniques for 16-Layer High-Layer-Count PCB Design

EMC Optimization Techniques for 16-Layer High-Layer-Count PCB Design

Electromagnetic Compatibility (EMC) is one of the key indicators for evaluating the performance of 16-layer high-layer-count PCBs. For 16-layer boards integrated with a large number of high-speed chips and complex power modules, electromagnetic interference (EMI) not only affects their own signal tr

EMC Optimization Techniques for 16-Layer High-Layer-Count PCB DesignJan 08, 2026 EMC Optimization Techniques for 16-Layer High-Layer-Count PCB Design1

DetailEMC Optimization Techniques for 16-Layer High-Layer-Count PCB Design

Technical Specifications for Free Prototyping of High-Layer Count PCBs

Technical Specifications for Free Prototyping of High-Layer Count PCBs

With the popularization of free prototyping services for high-layer-count PCBs (6 layers and above), the corresponding process specifications are also being continuously improved. High-layer-count boards have complex structures and high process difficulty. Their free fabrication specifications not o

Technical Specifications for Free Prototyping of High-Layer Count PCBsJan 07, 2026 Technical Specifications for Free Prototyping of High-Layer Count PCBs1

DetailTechnical Specifications for Free Prototyping of High-Layer Count PCBs
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