
Dec 03, 2025
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With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

In the field of electronic design, Altium Designer (AD), PADS, and Cadence Allegro are the three mainstream PCB design tools in engineering projects. Based on actual feedback from engineers, the following outlines the core features of these three software tools and the scenarios they are better sui
Jan 13, 2026
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**Comparison of Lamination Process between CEM-3 and FR-4**As two mainstream PCB substrate materials, CEM-3 and FR-4 share common principles in their lamination processes. However, due to differences in their material structures, they have developed unique process characteristics and quality control
Jan 12, 2026
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**Question: What is the core function of the Flexible PCB (FPC) Coverlay Lamination Process? What are the specific aspects of its specification formulation?** The FPC coverlay lamination process involves bonding a coverlay (an adhesive-backed polyimide film) onto the surface of an FPC. Its core fun
Jan 10, 2026
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PCB prototype SMT (Surface Mount Technology) is an indispensable part of modern electronics manufacturing. It provides a reference for circuit board testing before mass production, helps identify deficiencies, and thereby avoids unnecessary errors and losses. This article will explore PCB prototype
Jan 09, 2026
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Electromagnetic Compatibility (EMC) is one of the key indicators for evaluating the performance of 16-layer high-layer-count PCBs. For 16-layer boards integrated with a large number of high-speed chips and complex power modules, electromagnetic interference (EMI) not only affects their own signal tr
Jan 08, 2026
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With the popularization of free prototyping services for high-layer-count PCBs (6 layers and above), the corresponding process specifications are also being continuously improved. High-layer-count boards have complex structures and high process difficulty. Their free fabrication specifications not o
Jan 07, 2026
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