domestic pcb manufacturer-Shenzhen Chengchi Circuit Technology Co., Ltd.

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Shenzhen Chengchi Circuit Technology Co., Ltd.

Shenzhen Chengchi Circuit Technology Co., Ltd.

Shenzhen Chengchi Circuit Technology Co., Ltd.

Shenzhen Chengchi Circuit Technology Co., Ltd.

Shenzhen Chengchi Circuit Technology Co., Ltd.

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Dec 03, 2025 1

Core Principles and Full-Scenario Design of PCB Shielding Technology

If decoupling technology suppresses noise from "within the power supply," shielding technology blocks noise propagation from the "external environment." The two complement each other, forming the twin pillars of PCB noise reduction. In high-speed, RF (Radio Frequency), and high-EMI-sensitive scenari

May 28, 2026 351

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Factors Affecting the Glass Transition Temperature (Tg) of PCB Substrates

Factors Affecting the Glass Transition Temperature (Tg) of PCB SubstratesThe Glass Transition Temperature (Tg) of Printed Circuit Board (PCB) substrates is a critical metric indicating the temperature at which the material transitions from a rigid glassy state to a rubbery, high-elastic state. The T

May 27, 2026 71

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Is Your IoT 4-Layer PCB Failing EMC Certification Repeatedly?

Achieving First-Pass EMC Compliance: It’s Not About Shields, It’s About Ground PlanesThe key to one-pass EMC compliance for IoT 4-layer boards is not adding metal shields, but ensuring solid ground planes + digital/analog partitioning + local filtering. Blindly adding shields increases costs by 20%

May 26, 2026 526

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Hidden Hazards and Precise Diagnostic Methods for High-Resistance Via Failures in PCBs

High-resistance via failure in PCBs is a highly concealed and hazardous latent defect, characterized by electrical continuity but with a resistance value far exceeding the standard (normal via resistance ≤50mΩ, while high-resistance vias ≥200mΩ). The resistance value is unstable and fluctuates with

May 25, 2026 48

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Comprehensive Diagnosis and Full-Process Prevention System Construction for PCB Via Failures

Comprehensive Diagnosis and Full-Process Prevention System Construction for PCB Via FailuresAs the core carrier for interlayer electrical connections in multilayer circuit boards, the quality of PCB vias directly determines product reliability and service life. Via failures are characterized by comp

May 23, 2026 392

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Key Points to Note in PCB Design

I. Layout GuidelinesPartition Layout: Separate strong and weak power sections; partition digital and analog circuits; keep power, signal, and interface areas distinct.Centralize Core Components: Place the main control chip in the center to shorten trace lengths and reduce interference.Placement Prox

May 22, 2026 526

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