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With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

Know MoreShenzhen Chengchi Circuit Technology Co., Ltd.

Full-Dimensional Detection and Control of PCB Trace Stubs, Void Vias, and Ground Plane Breaks

Full-Dimensional Detection and Control of PCB Trace Stubs, Void Vias, and Ground Plane Breaks

Full-Dimensional Detection and Control of PCB Trace Stubs, Void Vias, and Ground Plane BreaksQ1: Why can a single inspection technology not comprehensively identify these three major defects? What is the core framework for full-dimensional detection?A: The three major defects (trace stubs, void vias

Full-Dimensional Detection and Control of PCB Trace Stubs, Void Vias, and Ground Plane BreaksMay 12, 2026 Full-Dimensional Detection and Control of PCB Trace Stubs, Void Vias, and Ground Plane Breaks535

DetailFull-Dimensional Detection and Control of PCB Trace Stubs, Void Vias, and Ground Plane Breaks

Key Factors to Consider When Formulating PCB Design Specifications

Key Factors to Consider When Formulating PCB Design Specifications

Key Factors to Consider When Formulating PCB Design SpecificationsAs the core carrier of electronic products, the Printed Circuit Board (PCB) directly affects product performance, reliability, and manufacturing cost. When formulating PCB design specifications, comprehensive consideration must be giv

Key Factors to Consider When Formulating PCB Design SpecificationsMay 11, 2026 Key Factors to Consider When Formulating PCB Design Specifications443

DetailKey Factors to Consider When Formulating PCB Design Specifications

​Integrated PCB+SMT DFM Quality Control for Multi-Layer Boards: Achieving Zero Voids and Zero Bridges

​Integrated PCB+SMT DFM Quality Control for Multi-Layer Boards: Achieving Zero Voids and Zero Bridges

Integrated PCB+SMT DFM Quality Control for Multi-Layer Boards: Achieving Zero Voids and Zero BridgesThe Challenge:During mass SMT assembly of new energy six-layer PCBs, severe defects emerged—including component tombstoning, cold solder joints (voids), solder bridging, and chip placement failures. R

​Integrated PCB+SMT DFM Quality Control for Multi-Layer Boards: Achieving Zero Voids and Zero BridgesMay 09, 2026 ​Integrated PCB+SMT DFM Quality Control for Multi-Layer Boards: Achieving Zero Voids and Zero Bridges11

Detail​Integrated PCB+SMT DFM Quality Control for Multi-Layer Boards: Achieving Zero Voids and Zero Bridges

Q: Basic PCB Schematic Normativity Checklist?

Q: Basic PCB Schematic Normativity Checklist?

Question: I just took over a PCB project design. Although many schematics appear finished with no software errors, functional anomalies, incorrect pin definitions, and package mismatches frequently occur after board fabrication. From an engineering practice perspective, what items should be prioriti

Q: Basic PCB Schematic Normativity Checklist?May 08, 2026 Q: Basic PCB Schematic Normativity Checklist?129

DetailQ: Basic PCB Schematic Normativity Checklist?

Strategies for Improving PCB Solder Joint Quality — Full-Dimensional Optimization of Materials, Processes, Design, and Control

Strategies for Improving PCB Solder Joint Quality — Full-Dimensional Optimization of Materials, Processes, Design, and Control

Improving PCB solder joint quality is a systematic engineering endeavor that requires a coordinated effort across five key dimensions: material selection, process optimization, design standards, process control, and personnel skills. This spans the entire workflow from PCB design and component procu

Strategies for Improving PCB Solder Joint Quality — Full-Dimensional Optimization of Materials, Processes, Design, and ControlMay 07, 2026 Strategies for Improving PCB Solder Joint Quality — Full-Dimensional Optimization of Materials, Processes, Design, and Control123

DetailStrategies for Improving PCB Solder Joint Quality — Full-Dimensional Optimization of Materials, Processes, Design, and Control

Recurring Cold Solder Joints on Power Supply PCBs? Identify Core Causes to Stabilize Mass Production Yield at 98%

Recurring Cold Solder Joints on Power Supply PCBs? Identify Core Causes to Stabilize Mass Production Yield at 98%

Recurring Cold Solder Joints on Power Supply PCBs? Identify Core Causes to Stabilize Mass Production Yield at 98%Engineers and procurement specialists working on industrial or automotive power supplies have all been plagued by cold solder joints: during mass production, power modules experience inte

Recurring Cold Solder Joints on Power Supply PCBs? Identify Core Causes to Stabilize Mass Production Yield at 98%May 06, 2026 Recurring Cold Solder Joints on Power Supply PCBs? Identify Core Causes to Stabilize Mass Production Yield at 98%352

DetailRecurring Cold Solder Joints on Power Supply PCBs? Identify Core Causes to Stabilize Mass Production Yield at 98%
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    Products

    PCBA OEM and ODM
    PCBA customization
    New energy PCBA
    Industrial control motherboard PCBA
    Consumer electronics PCBA
    Smart home PCBA
    Medical equipment PCBA

    capabilities

    PCB design and layout
    PCB Fabrication
    Purchasing & Supplier Management
    PCBA production
    PCBA testing and aging

    Cases

    Cases

    Applications

    Automotive
    Consumer
    Industry
    Communications
    Medical

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    Shenzhen Chengchi Circuit Technology Co., Ltd.

    Email

    ccdltiktok@gmail.com

    Contact: +8618129931046 (Mr. Liao )

    Tel: 0755-23739764

    Tel: +8618168762195 (Miss Lin)

    Add: Lanhuahan Technology Industrial Park, Pingshan New District, Shenzhen

    Shenzhen Chengchi Circuit Technology Co., Ltd. Shenzhen Chengchi Circuit Technology Co., Ltd. Shenzhen Chengchi Circuit Technology Co., Ltd. Shenzhen Chengchi Circuit Technology Co., Ltd. Shenzhen Chengchi Circuit Technology Co., Ltd.
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