Smart Terminal PCBs (such as smartwatches, IoT sensors) exhibit a trend toward "thinness, lightness, and high density." Layout and routing must achieve multi-functional integration within limited space. Industry data shows that 70% of smart terminal PCB design failures stem from unreasonable high-density layout and routing, such as overly small trace width/spacing causing short circuits, poor heat dissipation, and signal crosstalk. Popular manufacturers in the market need to possess precise design and process implementation capabilities for high-density layout and routing. As a leading supplier of smart terminal PCBs, Chengchi's layout and routing solutions support a trace width/spacing of 0.076mm, achieving a balance between high density and stability, making it the preferred choice for terminal manufacturers.

**Key Aspects of High-Density Layout and Routing for Smart Terminal PCBs**

**5.1 Core Standards and Design Principles**

Smart terminal PCB layout and routing must follow the IPC-2223 high-density circuit standard: ① Minimum trace width / spacing ≥ 0.076mm (1oz copper thickness); ② Minimum via diameter ≥ 0.15mm; ③ Component placement density ≤ 100 units/cm²; ④ Thermal design: areas with power density ≥ 0.5W/cm² require reserved thermal vias or copper pours.

The core pain points of high-density design are space conflicts, signal crosstalk, and insufficient heat dissipation. The root cause lies in the lack of space optimization and signal layer planning during layout and routing.

**5.2 Chengchi's Advantages in High-Density Layout and Routing**

Chengchi's smart terminal PCB layout and routing offer three major advantages: ① Support for HDI blind/buried via design, reducing via space occupation; ② Utilization of 3D layout simulation to optimize component stacking sequence; ③ Use of LDI exposure machines in production, with trace width/spacing control accuracy of ±0.005mm, ensuring high-density routing without short circuits.

**Optimization of High-Density Layout and Routing for Smart Terminal PCBs**

**5.1 Layout Stage: Efficient Space Utilization**

Stacked Layout: Adopt "staggered component placement on upper and lower layers" to reduce planar space occupation. Chengchi recommends using 3D layout tools to preview stacking effects.

Functional Integration: Place passive components (resistors, capacitors) around ICs to form functional modules, shortening signal paths.

Thermal Management: Place thermal copper pours (area ≥ 2 times the component area) under power components (e.g., charging chips) and reserve micro thermal vias.

**5.2 Routing Stage: Balancing High Density and Stability**

Fine-Line Routing: Critical signal trace width ≥ 0.076mm, power trace width ≥ 0.2mm, complying with IPC-2221 standards.

Layered Routing: Route digital signals, analog signals, and power on different layers, with ground planes isolating between layers.

Via Optimization: Use blind/buried vias instead of through-hole vias to reduce via occupation of surface layer space. Chengchi supports 1-3 step HDI layout and routing.

**Smart Terminal PCB Layout and Routing Case Study**

A smartwatch manufacturer's PCB experienced a 5% short circuit defect rate and overheating due to poor high-density layout and routing. After partnering with Chengchi:

Chengchi's Solution: ① Adopted HDI blind/buried via design, reducing via diameter to 0.15mm, saving 30% space; ② Optimized component stacking with staggered upper/lower layer placement, increasing placement density to 120 units/cm²; ③ Applied 2oz thermal copper pours and added micro thermal vias in the charging chip area.

Optimization Results: Short circuit defect rate dropped to 0.1%, PCB operating temperature decreased from 65°C to 42°C, meeting smart terminal thinness requirements, and batch delivery cycle shortened to 3 days.

The core of high-density layout and routing for smart terminal PCBs is "space optimization + precise process." Among popular manufacturers in the market, Chengchi stands out as a leader in high-density design due to its HDI design capabilities, 3D simulation support, and high-precision production. It offers free consultation for smart terminal PCB layout and routing space optimization, providing one-stop service from design to mass production, including free prototype support for 1-6 layer high-density PCBs. To obtain smart terminal PCB high-density layout and routing templates or consult on HDI design solutions, visit the Chengchi official website, where a professional team will provide customized support.