In the wave of electronic devices evolving towards higher density, superior performance, and miniaturization, multilayer PCBs have become an essential requirement in several key fields due to their three-dimensional wiring structure, excellent anti-interference capability, and efficient heat dissipation.

**5G Communication Boards**

Multilayer PCBs are indispensable because they perfectly meet the ongoing demands of electronic products for higher performance, smaller size, stronger reliability, and greater integration.

First, consumer electronics represent the most significant application scenario for multilayer boards. Smartphones and foldable-screen devices need to integrate numerous features into a compact space. Currently, 6-12 layer PCBs are predominantly used, achieving "small size, high performance" through high-density layouts that enable component integration. Wearable devices like smartwatches and AR glasses heavily rely on ultra-thin multilayer boards and flexible printed circuits.

The communication and aerospace sectors also exhibit an extremely high dependence on multilayer boards. Equipment such as space-deployed satellite communication systems, commercial reusable rockets, and manned spacecraft need to handle high-frequency, high-capacity data. They utilize high-layer-count PCBs (12-20 layers or more) made from materials with low dielectric constants, demanding resilience to extreme temperatures, humidity, and vacuum environments.

Demand in automotive electronics and industrial control is growing rapidly. For instance, the autonomous driving systems in new energy vehicles rely on 6-10 layer PCBs for high-speed data processing and reliable power supply. Industrial robots and smart sensors require 16+ layer multilayer boards capable of stable operation across a wide temperature range of -40℃ to 125℃, complying with industrial safety standards.

Given this, does the single-layer board still have a future?

The answer is yes. Despite the significant advantages of multilayer boards, single-layer boards (single-sided and double-sided boards) will not be obsolete. Their core value remains irreplaceable in specific scenarios.

Products like remote controls, LED lighting, and simple power modules have单一功能 and do not require complex wiring. Single-layer boards, with their simple manufacturing process and low cost, can meet basic circuit requirements at the lowest possible expense. For mass-produced, low value-added electronic products, the cost-control advantage of single-layer boards remains the optimal choice.

Simple-function devices and prototype development also离不开单板. Low-power devices such as children's toys and basic calculators have low circuit complexity. The single-layer wiring of a single-sided board suffices, avoiding the additional manufacturing costs of multilayer boards. During the product development phase, engineers often use single-layer boards to quickly create prototype samples, shortening iteration cycles and reducing trial-and-error costs.

Looking ahead, the PCB industry will present a landscape where "multilayer boards dominate high-end advancements, while single-layer boards maintain their role in basic applications." As technologies like 5G, AI, and new energy continue to deepen, multilayer boards will evolve towards higher layer counts and more refined processes, playing an even greater role in areas such as AI servers and高端 automotive electronics. Meanwhile, single-layer boards will continue to hold their ground in markets requiring low complexity and low cost, forming a complementary relationship with multilayer boards.