domestic pcb manufacturer_Shenzhen Chengchi Circuit Technology Co., Ltd.

AOI PCBA Inspection

AOI PCBA Inspection (Automated Optical Inspection for Printed Circuit Board Assemblies) is a specialized machine vision technology focused on verifying the quality of PCBAs by automatically identifying defects in components, soldering, and board layout. As a critical step in electronics manufacturin

Dec 11, 2025 1

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X-Ray PCBA Inspection

X-Ray PCBA Inspection is a non-destructive testing (NDT) technology that uses X-ray radiation to visualize internal and hidden defects in Printed Circuit Board Assemblies (PCBAs)—defects that are invisible to traditional optical inspection methods (like AOI). Unlike AOI, which relies on visible ligh

Dec 11, 2025 1

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PCBA Aging Test

PCBA Aging Test (also called PCBA burn-in test) is a reliability testing process designed to expose Printed Circuit Board Assemblies (PCBAs) to controlled environmental stress (e.g., high temperature, high humidity, electrical load) for an extended period—accelerating the failure of weak components

Dec 11, 2025 1

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High-Precision advanced assembly pcb for Industrial Control Systems

　　I. Core of High-Precision Technology: Signal Integrity & Industrial Reliability　　1. Lead-Free Solder Systems for Industrial Stability　　Mainstream High-Precision Industrial Solution: Sn-3.0Ag-0.5Cu-0.1Ni-0.05Ge alloy, optimized for precision signal interconnection (≤1μs response time), maintains le

Dec 10, 2025 1

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Multi-Layer advanced assembly pcb for Automotive Electronic Modules

　　I. Core of Multi-Layer Technology: High-Density Integration & Vehicle-Grade Reliability　　1. Lead-Free Solder Systems for Automotive Durability　　Mainstream Multi-Layer Automotive Solution: Sn-3.0Ag-0.5Cu-0.1Ni-0.05Ge alloy, optimized for 8~24-layer PCB interconnection, maintains lead content below

Dec 10, 2025 1

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Medical-Grade advanced assembly pcb for Diagnostic Equipment

　　I. Core of Medical-Grade Technology: Biocompatibility & Diagnostic Precision Adaptation　　1. Lead-Free Solder Systems for Medical Reliability　　Mainstream Medical-Grade Solution: Sn-3.0Ag-0.5Cu-0.05Ni-0.03Ge alloy, optimized for long-term stable operation (≥10 years), maintains lead content below 50

Dec 10, 2025 1

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Rapid-Prototype advanced assembly pcb for Electronic Product Development

　　I. Core of Rapid-Prototype Technology: Fast-Adaptive Innovation & Efficient Process　　1. Lead-Free Solder Systems for Prototype Compatibility　　Mainstream Rapid-Prototype Solution: SAC305 (Sn96.5%/Ag3.0%/Cu0.5%) alloy, optimized for fast assembly (24-hour turnaround), maintains lead content below 50

Dec 10, 2025 1

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High-Temperature Resistant advanced assembly pcb for New Energy Devices

　　I. Core of High-Temperature Technology: Heat-Resistant Innovation & Process Optimization　　1. Lead-Free Solder Systems for High-Temperature Stability　　Mainstream High-Temp Solution: Sn-3.0Ag-0.5Cu-0.1Ni-0.05Ge alloy, optimized for continuous 125℃ operation, maintains lead content below 50ppm (EU Ro

Dec 10, 2025 1

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Customized advanced assembly pcb for Smart Home Appliances

　　I. Core of Customized Technology: Scenario-Adaptive Innovation & Process Optimization　　1. Lead-Free Solder Systems for Smart Home Compatibility　　Mainstream Customization Solution: Sn-0.7Cu-0.3Ag (Sn99.0%/Cu0.7%/Ag0.3%) alloy, balanced for cost and reliability, maintains lead content below 50ppm (E

Dec 10, 2025 1

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ISO-Certified advanced assembly pcb for Aerospace Equipment

　　I. Core of Aerospace-Grade Technology: High-Reliability & Extreme Environment Adaptation　　1. Lead-Free Solder Systems for Aerospace Reliability　　Mainstream Aerospace Solution: Sn-Ag-Cu-Ge (Sn96.5%/Ag3.0%/Cu0.5%/Ge0.05%) alloy, optimized for long-term service (≥20 years), maintains lead content bel

Dec 10, 2025 1

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Miniaturized advanced assembly pcb for Portable Smart Devices

　　I. Core of Miniaturization Technology: Ultra-Precision Innovation & Process Optimization　　1. Lead-Free Solder Systems for Miniaturized Components　　Mainstream Miniaturization Solution: SAC0307 (Sn99.0%/Ag0.3%/Cu0.7%) alloy, optimized for ultra-small pads (0.2mm pitch), maintains lead content below

Dec 10, 2025 1

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Mass-Produced advanced assembly pcb for IoT Sensor Modules

　　I. Core of Lead-Free Technology: Mass-Production-Compatible Innovation & Process Optimization　　1. Lead-Free Solder Systems for High-Yield Mass Production　　Mainstream Mass-Production Solution: SAC305 (Sn96.5%/Ag3.0%/Cu0.5%) alloy, optimized for automated assembly lines, maintains lead content below

Dec 10, 2025 1

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Lead-Free advanced assembly pcb for Green Electronic Products

　　I. Core of Lead-Free Technology: Material Innovation and Process Breakthroughs　　1. Upgrading of Lead-Free Solder Systems　　Mainstream Solution: SAC305 (Sn96.5%/Ag3.0%/Cu0.5%) alloy, optimized through silver-copper ratio adjustment, controls lead content below 50ppm (EU RoHS limit: 1000ppm) and impr

Dec 10, 2025 1

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DIP Through-Hole Assembly

DIP (Dual In-line Package) through-hole assembly is a traditional PCBA manufacturing process that inserts component leads through drilled holes in PCBs, followed by soldering to create mechanical and electrical connections. This method is ideal for components requiring high mechanical stability, hig

Dec 10, 2025 1

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Small-Batch PCBA Processing

Small-batch PCBA processing caters to production volumes typically ranging from 10 to 500 units, addressing the needs of R&D teams, startups, and specialized industries (e.g., medical devices, aerospace) where large-scale production is not feasible or necessary. This service balances flexibility, sp

Dec 10, 2025 1