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What problems are common during PCB fabrication?

Time:2025-11-13 Views:1

  

  When designing PCBs using software, we often encounter situations where components that appear connected (for electrical performance) are actually not. Therefore, following the correct order of operations is crucial when starting PCB fabrication based on the design file. Today, we'll focus on three key solutions to common problems encountered during PCB fabrication.

  1. Creating Physical Borders

  Creating a closed physical border on the original board serves as a constraint for later component placement and routing. A well-defined physical border allows for more standardized component soldering and accurate routing. However, it's particularly important to note that the physical border should be rounded for curved edges or corners. This prevents sharp corners from injuring workers and reduces stress, ensuring safety during transport.

  2. Introducing Components and Nets

  Introducing components and nets into the drawn border should be straightforward, but this is where problems often arise. Carefully address each error as indicated by the prompts; otherwise, you'll have to spend significantly more time later. The problems here generally include the following:

  The component package cannot be found, there are component network issues, and there are unused components or pins. These problems can be quickly resolved by referring to the prompts.

  3. Standardization of Component Layout

  (1) Placement Order

  Experienced installers will first place components in fixed positions related to the structure, such as power sockets, indicator lights, switches, and connectors. Then, they will lock these components in software to ensure that the placement of other components later will not move or affect the fixed-position components. For complex boards, we can repeat the process several times according to the placement order.

  (2) Attention to the Impact of Layout on Heat Dissipation

  Special attention should be paid to heat dissipation in component layout. For high-power circuits, heat-generating components such as power transistors and transformers should be placed as far apart as possible to facilitate heat dissipation. They should not be concentrated in one place, nor should high-capacitance components be placed too close together to avoid premature aging of the electrolyte.

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