PCBA component assembly is a core process that bridges circuit design and practical application, requiring strict adherence to technical standards and operational norms. The process typically starts with solder paste printing, where a stencil is used to apply a precise amount of solder paste onto the PCB pads. This step is critical because the thickness and uniformity of the solder paste directly affect the subsequent soldering quality—insufficient paste may lead to poor connections, while excess paste can cause short circuits.

After solder paste printing, the next stage is component placement, which is usually completed by high-precision automated placement machines. These machines use vision systems to identify component packages (such as SMD, through-hole) and accurately place them on the corresponding pads. For special components like large capacitors or connectors, manual assistance may be required to ensure proper alignment, especially when dealing with non-standard package sizes.

The final step in assembly is inspection and testing. AOI (Automated Optical Inspection) systems are widely used to detect defects such as missing components, offset placements, and solder paste anomalies. For high-reliability applications like automotive or aerospace PCBs, additional X-ray inspection may be performed to check the soldering quality of hidden joints, ensuring the assembled PCBA meets the required performance and durability standards.