Welcome to Shenzhen Chengchi Circuit Technology Co., Ltd official website

CN Shenzhen Chengchi Circuit Technology Co., Ltd.
Service Hotline

+8618129931046 Mr. Liao

Shenzhen Chengchi Circuit Technology Co., Ltd.
EN
Shenzhen Chengchi Circuit Technology Co., Ltd. Shenzhen Chengchi Circuit Technology Co., Ltd.

News

Home >  News > Industry News > 

PCBA Soldering Quality Inspection Points

Time:2026-04-18 Views:289

PCBA Soldering Quality Inspection Points

PCBA soldering quality is the core guarantee of electronic product reliability, and its inspection needs to cover the entire soldering process, focusing on the appearance, structure and electrical performance of solder joints. First of all, the appearance inspection of solder joints is the most basic and direct method. Qualified solder joints should have a smooth, shiny surface without obvious defects such as burrs, voids, cold solder, and bridging. The solder should wet the pad and the pin of the component evenly, forming a uniform fillet with a reasonable size—neither too much solder leading to solder accumulation nor too little solder causing poor connection. For surface mount technology (SMT) components, the solder joint should fully cover the pad, and there should be no solder missing on the side of the component pin; for through-hole components, the solder should penetrate the through-hole and form a uniform solder fillet on both the top and bottom of the PCB, without solder blockage or insufficient penetration.

In addition to appearance inspection, electrical performance testing is also an essential part of soldering quality inspection. This includes using a multimeter to test the continuity of solder joints, checking for open circuits or short circuits caused by poor soldering. For high-precision PCBA, in-circuit testing (ICT) can be used to comprehensively detect the soldering quality of each component and the connection between components, ensuring that each solder joint meets the electrical performance requirements. At the same time, the mechanical strength of solder joints should be inspected. By gently touching or using professional tools to test the firmness of components, it can be judged whether the solder joint has sufficient bonding force, avoiding poor soldering caused by weak bonding that may lead to component falling off during use. It is also necessary to check for potential defects such as solder balls, which may cause short circuits between adjacent pads and affect the normal operation of the PCBA. All inspection processes should be carried out in accordance with relevant industry standards to ensure the consistency and reliability of soldering quality.

Save Time

Save Time

Save Money

Save Money

Save Labour

Save Labour

Free From Worry

Free From Worry