The CEM3 (Composite Epoxy Material 3) material offers several significant performance advantages when used in double - sided boards, making it a popular choice in the electronics manufacturing industry.

　　One of the primary advantages of CEM3 material is its excellent electrical insulation properties. CEM3 is composed of a glass - epoxy composite with a unique structure that provides high - quality electrical insulation between the copper traces on the double - sided board. This is crucial for preventing electrical short - circuits and ensuring the reliable operation of the circuit. The low dielectric constant and dissipation factor of CEM3 material reduce signal attenuation and electromagnetic interference, allowing for high - speed signal transmission. In applications where fast data transfer is required, such as in high - performance computing and communication devices, the use of CEM3 material in double - sided boards can significantly improve the signal integrity and overall performance of the circuit.

　　CEM3 material also exhibits good mechanical strength and dimensional stability. It has a high modulus of elasticity, which means it can withstand mechanical stresses without deforming easily. This is important for double - sided boards, as they need to support the weight of the mounted components and resist external forces, such as vibrations and impacts. The dimensional stability of CEM3 material ensures that the board maintains its shape and size during the manufacturing process and under different environmental conditions. This reduces the risk of warping, which can cause problems with component alignment and electrical connections. Additionally, CEM3 has good resistance to moisture absorption, preventing issues such as delamination and corrosion of the copper traces, which can occur when the board is exposed to humid environments.

　　In terms of processing, CEM3 material is relatively easy to work with. It can be drilled and routed with standard PCB manufacturing equipment, allowing for the creation of complex double - sided board designs. The material also has good adhesion to copper, ensuring reliable electrical connections between the traces and the substrate. This ease of processing contributes to the cost - effectiveness of using CEM3 in double - sided board production, as it reduces the manufacturing time and the likelihood of production errors.

　　Furthermore, CEM3 material is considered to be more environmentally friendly compared to some other PCB substrate materials. It does not contain harmful substances such as halogens, which are restricted in many countries due to their environmental impact. This makes CEM3 a suitable choice for manufacturers who are aiming to produce products that comply with environmental regulations and meet the growing demand for green electronics.