Technical Features and Core Requirements

　　1. High Voltage and High Current Carrying Capacity

　　Voltage Range: The voltage range has leaped from 12V/24V for traditional fuel vehicles to the 400V-800V high-voltage platform for new energy vehicles, with some supercharging models exceeding 1000V.

　　Current Density: The motor controller must handle instantaneous currents of 200-500A, and the battery management system (BMS) must have over 128 single-cell monitoring channels. Signal acquisition error must be controlled within ±1mV.

　　Solution:

　　Thick Copper Foil Technology: Utilizes an ultra-thick copper layer of 3-6OZ (105-210μm), reducing resistance by 60% compared to traditional 1OZ copper foil. A grid copper design and ground vias optimize heat dissipation.

　　Insulation and Spacing Design: High-voltage line spacing is ≥0.5mm, insulation layer thickness is ≥0.2mm, and a ceramic-filled PTFE substrate (dielectric constant Dk=3.0) is used to enhance high-voltage performance. 2. Reliability in Extreme Environments

　　Temperature Range: Requires stable operation in extreme temperature fluctuations ranging from -40°C to 150°C (up to 200°C in some areas), such as in the engine compartment's ECU module.

　　Vibration and Shock Resistance: Vehicle vibration frequencies reach 10-2000Hz and accelerations reach 20G. Mechanical strength must be enhanced through thick-walled plated through-holes (hole copper thickness ≥ 25μm) and red glue fastening components.

　　Corrosion Resistance and Protection: Requires passing a 1000-hour salt spray test in coastal areas. The battery pack's interior must withstand electrolyte corrosion, utilizing nickel-palladium-gold (ENEPIG) plating and a halogen-free flame-retardant substrate (UL94 V-0 rating). 3. High-Frequency Signals and Electromagnetic Compatibility

　　Millimeter-Wave Radar: The 77 GHz frequency band requires PCB material dielectric constant (Dk) tolerances ≤ ±0.05 and dissipation factor (Df) < 0.002. Ultra-low-roughness copper foil (surface roughness 0.7 μm RMS) such as Rogers RO3003G2™ is used to optimize signal integrity.

　　Electromagnetic Interference Suppression: An inner copper foil mesh shield (20 μm thickness) and equal-length differential trace routing (tolerance < ±5%) reduce electromagnetic radiation emissions by 18 dBμV/m, meeting ISO 11452-2 standards.

　　4. Intelligence and Integration

　　Multi-chip Integration: The BMS main control chip must integrate an MCU, AFE (analog front end), and communication module. Rigid-flex boards (bending radius ≤ 5 mm) are used to accommodate the complex spatial layout within the battery pack. Embedded technology: IGBT power devices are directly embedded in the PCB, reducing the package volume by 30% and optimizing the heat dissipation path through laser drilling (aperture ≤ 0.15mm).