Key Testing Points (Adapting to Consumer Electronics Characteristics)

　　Prioritize efficiency and match the pace of mass production. Consumer electronics can reach production volumes in the millions, so testing must support high-speed, automated processes:

　　Utilize "assembly line testing": For example, PCBAs automatically transition from AOI to ICT to FCT, keeping the total testing time per unit under 1 minute.

　　Fast fixture switching: During R&D iterations, fixture replacement time should be ≤ 2 hours to avoid impacting new product ramp-up.

　　Maintain a cost balance and avoid excessive testing. Profit-sensitive consumer electronics require a test strategy based on risk level:

　　High-risk items (e.g., BGA soldering, RF functionality): 100% inspection.

　　Low-risk items (e.g., resistor and capacitor values): Sampling testing (AQL 1.0) to reduce testing costs. Data traceability facilitates problem location. The test system must record test data for each PCBA (such as test time, defective items, and device number). When defects occur in a batch, they can be quickly traced back to the specific batch and workstation, shortening troubleshooting time. (For example, RF defects in a batch of mobile phones can be traced back to an abnormal soldering temperature curve.)

　　To adapt to miniaturized devices, consumer electronics components are trending towards miniaturization (e.g., 01005 packages, BGA pitch 0.4mm). Test equipment requires improved accuracy:

　　AOI resolution must reach 10μm to identify misassembled or missing 01005 components;

　　X-ray magnification must reach 500x or higher to detect tiny voids (≤0.1mm in diameter) in BGA solder joints.