Welcome to Shenzhen Chengchi Circuit Technology Co., Ltd official website

CN Shenzhen Chengchi Circuit Technology Co., Ltd.
Service Hotline

+8618129931046 Mr. Liao

Shenzhen Chengchi Circuit Technology Co., Ltd.
EN
Shenzhen Chengchi Circuit Technology Co., Ltd. Shenzhen Chengchi Circuit Technology Co., Ltd.

News

Home >  News > 

Visit from American partners

Visit from American partners

Visit from American partnersDec 03, 2025 Visit from American partners1

With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

Know MoreShenzhen Chengchi Circuit Technology Co., Ltd.

ENIG (Electroless Nickel Immersion Gold) Process for Multilayer PCBs

ENIG (Electroless Nickel Immersion Gold) Process for Multilayer PCBs

    ENIG, or Electroless Nickel Immersion Gold, is a popular surface finish for multilayer printed circuit boards (PCBs). This process is favored for its excellent surface planarity, good solderability, and wire bondability. The ENIG process involves depositing a layer of nickel followed by a thin l

ENIG (Electroless Nickel Immersion Gold) Process for Multilayer PCBsJun 25, 2025 ENIG (Electroless Nickel Immersion Gold) Process for Multilayer PCBs1

DetailENIG (Electroless Nickel Immersion Gold) Process for Multilayer PCBs

Design of Digital-Analog Mixed Circuits in PCB

Design of Digital-Analog Mixed Circuits in PCB

    The design of digital-analog mixed circuits in printed circuit boards (PCBs) presents unique challenges and requires careful consideration of various factors to ensure optimal performance. Digital circuits operate on discrete voltage levels representing binary values, while analog circuits deal

Design of Digital-Analog Mixed Circuits in PCBJun 24, 2025 Design of Digital-Analog Mixed Circuits in PCB1

DetailDesign of Digital-Analog Mixed Circuits in PCB

Application of Multilayer Boards in Smart Grid Equipment

Application of Multilayer Boards in Smart Grid Equipment

    Multilayer printed circuit boards (PCBs) play a crucial role in the development and operation of smart grid equipment, enabling the efficient management and distribution of electrical power. The smart grid, characterized by its integration of advanced information and communication technologies w

Application of Multilayer Boards in Smart Grid EquipmentJun 24, 2025 Application of Multilayer Boards in Smart Grid Equipment1

DetailApplication of Multilayer Boards in Smart Grid Equipment

Environmentally Friendly Surface Treatment Processes for PCB Boards

Environmentally Friendly Surface Treatment Processes for PCB Boards

    In an era of increasing environmental awareness and strict regulations, the development of environmentally friendly surface treatment processes for PCB boards has become imperative. Traditional surface treatment methods often involve the use of hazardous substances, such as lead-based solders an

Environmentally Friendly Surface Treatment Processes for PCB BoardsJun 24, 2025 Environmentally Friendly Surface Treatment Processes for PCB Boards1

DetailEnvironmentally Friendly Surface Treatment Processes for PCB Boards

Electroless Copper Plating Process for Multilayer Boards

Electroless Copper Plating Process for Multilayer Boards

    Electroless copper plating is a pivotal process in the fabrication of multilayer printed circuit boards (PCBs), enabling the formation of conductive pathways without the need for an external electric current. This technique is based on a chemical reduction reaction, where copper ions in the plat

Electroless Copper Plating Process for Multilayer BoardsJun 24, 2025 Electroless Copper Plating Process for Multilayer Boards1

DetailElectroless Copper Plating Process for Multilayer Boards

Detailed Explanation of the Backdrill Process for Double-Sided PCBs

Detailed Explanation of the Backdrill Process for Double-Sided PCBs

    The backdrill process is an important technique used in the manufacturing of double-sided PCBs to improve signal integrity and reduce electrical losses. In a double-sided PCB, when vias are drilled through the board to connect the top and bottom layers, the unused portion of the via barrel (the

Detailed Explanation of the Backdrill Process for Double-Sided PCBsJun 23, 2025 Detailed Explanation of the Backdrill Process for Double-Sided PCBs1

DetailDetailed Explanation of the Backdrill Process for Double-Sided PCBs
  • <
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • >
  • Save Time

    Save Time

    Save Money

    Save Money

    Save Labour

    Save Labour

    Free From Worry

    Free From Worry