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Visit from American partners

Visit from American partners

Visit from American partnersDec 03, 2025 Visit from American partners1

With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

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Failure Analysis Methods for Printed Circuit Boards

Failure Analysis Methods for Printed Circuit Boards

　　　　Printed Circuit Boards (PCBs) are integral to modern electronics, and their failure can lead to significant system malfunctions. The failure analysis of PCBs involves a systematic approach to identify the root cause of issues. The first step is visual inspection, which uses microscopes and imagi

Failure Analysis Methods for Printed Circuit BoardsJul 08, 2025 Failure Analysis Methods for Printed Circuit Boards1

DetailFailure Analysis Methods for Printed Circuit Boards

Material Selection for High-Frequency and High-Speed Multilayer Boards

Material Selection for High-Frequency and High-Speed Multilayer Boards

　　　　In the design of multilayer printed circuit boards (PCBs) for high-frequency and high-speed applications, material selection is critical to ensuring signal integrity, minimizing loss, and maintaining reliable performance. The unique challenges of high-frequency (HF) and high-speed (HS) environme

Material Selection for High-Frequency and High-Speed Multilayer BoardsJul 07, 2025 Material Selection for High-Frequency and High-Speed Multilayer Boards1

DetailMaterial Selection for High-Frequency and High-Speed Multilayer Boards

Liquid - Cooling Design for Multilayer Circuit Boards

Liquid - Cooling Design for Multilayer Circuit Boards

　　　　With the increasing power density of multilayer circuit boards, especially in high - performance computing, data centers, and aerospace applications, liquid - cooling design has become an essential solution for effective thermal management.　　The basic principle of liquid - cooling for multilayer

Liquid - Cooling Design for Multilayer Circuit BoardsJul 04, 2025 Liquid - Cooling Design for Multilayer Circuit Boards1

DetailLiquid - Cooling Design for Multilayer Circuit Boards

Application of PCBs in 5G Base Station Equipment

Application of PCBs in 5G Base Station Equipment

　　　　PCBs play a vital role in 5G base station equipment, enabling the high - speed data transmission and complex signal processing required by the fifth - generation wireless technology.　　In 5G base stations, high - frequency PCBs are used in radio frequency (RF) front - end modules. These PCBs need

Application of PCBs in 5G Base Station EquipmentJul 04, 2025 Application of PCBs in 5G Base Station Equipment1

DetailApplication of PCBs in 5G Base Station Equipment

High - Reliability Testing Standards for Multilayer PCBs

High - Reliability Testing Standards for Multilayer PCBs

　　　　High - reliability testing of multilayer PCBs is essential to ensure their performance and longevity in various applications, especially in aerospace, military, and automotive industries. Several international and industry - specific standards govern these tests.　　One of the most widely recogniz

High - Reliability Testing Standards for Multilayer PCBsJul 04, 2025 High - Reliability Testing Standards for Multilayer PCBs1

DetailHigh - Reliability Testing Standards for Multilayer PCBs

Laser Drilling Process for Blind and Buried Vias in Multilayer Boards

Laser Drilling Process for Blind and Buried Vias in Multilayer Boards

　　　　The laser drilling process for blind and buried vias in multilayer printed circuit boards (PCBs) has revolutionized the manufacturing of high - density interconnect (HDI) boards. Blind vias connect outer layers to inner layers without passing through the entire board, while buried vias link inte

Laser Drilling Process for Blind and Buried Vias in Multilayer BoardsJul 04, 2025 Laser Drilling Process for Blind and Buried Vias in Multilayer Boards1

DetailLaser Drilling Process for Blind and Buried Vias in Multilayer Boards
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    Products

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    Shenzhen Chengchi Circuit Technology Co., Ltd.

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    Contact: +8618129931046 (Mr. Liao )

    Tel: 0755-23739764

    Tel: +8618168762195 (Miss Lin)

    Add: Lanhuahan Technology Industrial Park, Pingshan New District, Shenzhen

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