
Dec 03, 2025
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With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

As a PCB engineer who routinely works with high-power, high-density boards, in projects like LED lighting, automotive electronics, and power modules, metal-core substrates are no longer optional materials but a necessity. Many designers new to metal-core substrates tend to treat them as "thickened s
Feb 04, 2026
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During the full lifecycle of micro-sized PCBs, assembly and soldering constitute a high-risk failure phase second only to design and fabrication. Micro-components and minute solder pads place extremely high demands on soldering process precision, temperature control, and equipment. Even a slight dev
Feb 03, 2026
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In the wave of electronic devices evolving towards higher density, superior performance, and miniaturization, multilayer PCBs have become an essential requirement in several key fields due to their three-dimensional wiring structure, excellent anti-interference capability, and efficient heat dissipa
Feb 02, 2026
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SMT (Surface Mount Technology) placement is a core backend process in PCB batch production. The efficiency and yield of an automated SMT line heavily depend on the preliminary PCB layout design. In the batch projects I've encountered, nearly 30% of SMT defects can be traced back to PCB layout issues
Jan 30, 2026
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A PCB dust cover is a protective enclosure designed to shield printed circuit boards from dust, debris, moisture, and other environmental contaminants that can degrade performance or cause electrical failures. These covers are essential in applications such as industrial machinery, outdoor electroni
Jan 30, 2026
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PCB thermal design focuses on managing heat generation and dissipation within a printed circuit board to ensure components operate within their safe temperature ranges, preventing performance degradation, reliability issues, or premature failure. Electronic components—especially high-power devices l
Jan 29, 2026
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