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Visit from American partners

Visit from American partners

Visit from American partnersDec 03, 2025 Visit from American partners1

With the continuous development of science and technology, PCB board industry is also moving forward, technology upgrading has become a key element of the development of the industry...

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Core Logic and Engineering Baseline of PCB Via Pitch

Core Logic and Engineering Baseline of PCB Via Pitch

In multilayer PCB design, vias are the central hubs for interlayer signal and power interconnects. While Via Pitch may seem like a basic process parameter, it directly dictates PCB mass production yield, signal integrity (SI), and EMC compliance. Numerous engineering cases show that over 70% of high

Core Logic and Engineering Baseline of PCB Via PitchJun 03, 2026 Core Logic and Engineering Baseline of PCB Via Pitch153

DetailCore Logic and Engineering Baseline of PCB Via Pitch

Multi-layer High-density Interconnection Design for Robot Motor Drive PCB

Multi-layer High-density Interconnection Design for Robot Motor Drive PCB

Robot motor drive systems require PCB boards with excellent power carrying capacity, anti-interference performance and structural integration, making multi-layer high-density interconnection the core design requirement. Modern industrial robots and mobile service robots are equipped with multiple jo

Multi-layer High-density Interconnection Design for Robot Motor Drive PCBJun 02, 2026 Multi-layer High-density Interconnection Design for Robot Motor Drive PCB200

DetailMulti-layer High-density Interconnection Design for Robot Motor Drive PCB

​PCB Flying Probe Test vs. Fixture Test: Selection Comparison and Application Guide

​PCB Flying Probe Test vs. Fixture Test: Selection Comparison and Application Guide

In the final stage of PCB manufacturing, Electrical Test serves as the critical checkpoint for intercepting defective products and ensuring delivery quality. The industry primarily relies on two methods: the Flying Probe Test and the Fixture Test (also known as the Bed-of-Nails Test). Many procureme

​PCB Flying Probe Test vs. Fixture Test: Selection Comparison and Application GuideJun 02, 2026 ​PCB Flying Probe Test vs. Fixture Test: Selection Comparison and Application Guide485

Detail​PCB Flying Probe Test vs. Fixture Test: Selection Comparison and Application Guide

Ensuring Signal Integrity in 4-Layer PCB Return Path Design

Ensuring Signal Integrity in 4-Layer PCB Return Path Design

In the field of modern high-speed digital circuit design, 4-layer PCBs are widely used in communication equipment, industrial control, consumer electronics, and various embedded systems due to their balance between cost and performance. However, with the continuous increase in signal frequencies, ev

Ensuring Signal Integrity in 4-Layer PCB Return Path DesignJun 01, 2026 Ensuring Signal Integrity in 4-Layer PCB Return Path Design405

DetailEnsuring Signal Integrity in 4-Layer PCB Return Path Design

Which to Choose Between PCB Surface Finishes HASL and ENIG

Which to Choose Between PCB Surface Finishes HASL and ENIG

When selecting a surface finish for printed circuit boards (PCBs), Hot Air Solder Leveling (HASL) and Electroless Nickel Immersion Gold (ENIG) are two of the most widely used options, each with distinct advantages, limitations, and ideal application scenarios. The choice between them depends on fact

Which to Choose Between PCB Surface Finishes HASL and ENIGMay 30, 2026 Which to Choose Between PCB Surface Finishes HASL and ENIG257

DetailWhich to Choose Between PCB Surface Finishes HASL and ENIG

Lead-Free Solder Empowers Flexible PCB Assembly with Balanced Process Performance

Lead-Free Solder Empowers Flexible PCB Assembly with Balanced Process Performance

Flexible PCBs (FPC), characterized by their lightness, thinness, bendability, deformation resistance, and high spatial adaptability, are now widely used in wearables, smart terminals, automotive electronics, medical instruments, and industrial flexible sensor modules. With tightening global environm

Lead-Free Solder Empowers Flexible PCB Assembly with Balanced Process PerformanceMay 30, 2026 Lead-Free Solder Empowers Flexible PCB Assembly with Balanced Process Performance48

DetailLead-Free Solder Empowers Flexible PCB Assembly with Balanced Process Performance
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    Products

    PCBA OEM and ODM
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    Industrial control motherboard PCBA
    Consumer electronics PCBA
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    capabilities

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    Shenzhen Chengchi Circuit Technology Co., Ltd.

    Email

    ccdltiktok@gmail.com

    Contact: +8618129931046 (Mr. Liao )

    Tel: 0755-23739764

    Tel: +8618168762195 (Miss Lin)

    Add: Lanhuahan Technology Industrial Park, Pingshan New District, Shenzhen

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