High frequency PCB Manufacturer-Shenzhen Chengchi Circuit Technology Co., Ltd.

PCB Classification by Manufacturing Process: A Complete Guide to HDI, Heavy Copper, and Impedance Control Boards

For PCBs with identical base materials and layer counts, adopting different manufacturing processes results in drastically different finished board capabilities. Many engineers focus solely on layer count and substrate, overlooking how process choices define capability boundaries. Designs are often

Aug 17, 2026 214

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Application Scenarios and Pitfall Guide for White, Red, and Blue Solder Masks

Beyond the classic green and black, colored solder masks—white, red, blue, and others—are increasingly common in various products. White PCBs are widely used in LED lighting; red is often seen on development boards and high-voltage warning labels; and blue is prevalent in certain industrial control

Aug 15, 2026 166

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Key Points for Manufacturing AI Server PCBs

AI server PCBs are high-end products governed by IPC‑6012 Class 3. Their fabrication process is complex, involving special processes such as high-layer-count lamination, back drilling, HDI, low-loss material machining, VLP copper foil, and resin-filled vias. In many projects, simulation, schematics,

Aug 14, 2026 190

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A Comprehensive Analysis of PCB Stack-Up and Via Design for AI Servers

In AI server 24–36 layer high-multilayer PCBs, stack-up planning is no longer merely about allocating signal and power layers; it is a comprehensive design endeavor involving signal integrity (SI), power integrity (PI), lamination processes, board thickness aspect ratios, and back-drilling technique

Aug 13, 2026 145

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Thermal Management and EMC Co-Design: PCB Protection Process Requirements for High-Density Optical Modules

The enclosures of 800G optical modules are compact and sealed, featuring high thermal density in DSPs and laser driver chips, coupled with strong electromagnetic radiation from high-frequency channels. Optimizing trace routing alone is insufficient to address issues such as thermal throttling and EM

Aug 12, 2026 394

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First-Round Closed-Loop Verification: Schematics, Footprint Libraries, and Mechanical Constraints

The root cause of most post-design PCB rework lies in oversights during the pre-design data preparation phase. This initial front-end review acts as a safeguard, intercepting potential risks before layout and routing begin. Many engineers import the netlist and jump straight into routing, neglecting

Aug 11, 2026 170