High frequency PCB Manufacturer-Shenzhen Chengchi Circuit Technology Co., Ltd.

Refined Reliability Control for Lamination, Drilling, and Metallization Processes in Automotive PCBs

In failure analysis of electric vehicle (EV) PCB batches, delamination and plated-through-hole (PTH) cracking collectively account for over 60% of all reliability failures, with particularly severe issues observed in BMS acquisition boards, motor controller multilayer boards, and 800V high-voltage b

Jun 23, 2026 383

Detail

USB connectors look simple—but get the PCB wrong, and you’re looking at a signal disaster.

Isn’t it just two lines, D+ and D-?Isn’t it just dropping in a connector and adding a few protection components?Anyone who has actually done real projects knows the truth:The most common USB problems usually don’t come from the schematic—they come from the PCB layout.Intermittent PC recognition, no

Jun 22, 2026 248

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Process Control for Black Solder Mask Silkscreen on PCBs: How to Prevent Typical Defects Like Stringing and Pinholes

Black silkscreen defects represent a high incidence category in PCB appearance-related customer complaints. Common issues include stringing (threading), ragged edges, pinholes/bubbles, missing or faint characters, misalignment, ink build-up (smearing), and poor adhesion/peeling. Unfortunately, many

Jun 18, 2026 375

Detail

TWS Earphone PCB Antenna Design

TWS (True Wireless Stereo) earphone PCB antenna design is a core part of wireless communication performance optimization, which needs to balance miniaturization, signal stability, and wearable scenario adaptability. Limited by the ultra-compact internal space of TWS earphones, PCB built-in antennas

Jun 18, 2026 533

Detail

Recyclable PCB Forward Design Specification: An End-to-End Optimization Guide

Most enterprises only consider recycling and disposal after a product reaches its end-of-life, overlooking the decisive impact of front-end PCB design on recycling efficiency. For two PCBAs with identical functionality, a rational recyclability-oriented layout can increase metal recovery rates by 15

Jun 17, 2026 499

Detail

Process Difficulties of Mobile Phone Motherboard HDI Boards

HDI (High Density Interconnect) boards are the core carrier of modern smartphone motherboards, adapting to the trend of thin, light, and high-integration mobile terminals. The biggest technical challenge of HDI board manufacturing lies in micro-hole processing and ultra-fine line production, which a

Jun 17, 2026 342